Pressure-Indicating Film Characterization of Wafer-to-Wafer Bonding

Wafer-to-wafer bonding has become an enabling semiconductor technology in industries such as 3D packaging, MEMS, MOEMS, and SOI. In a typical wafer bonding process, two flat substrates are permanently joined (bonded) to one another by applying precise combinations of physical pressure, temperature, and/or voltage (Figure 1). Each of the above factors is set depending on the substrate materials being bonded, and the control of these parameters is crucial to a successful, high-quality, high-uniformity manufacturing process.

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